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Author ：Green earth– LED Strip Lights manufacturers
Conductive heat dissipation typically includes system-level heat dissipation and packaging heat dissipation, in order to reduce the heat resistance of the lamp, it is necessary to consider two heat dissipation methods. When the LED source is produced, the heat dissipation through the packaging material, the packaging structure, and the process level, thereby achieving heat dissipation. In packaging heat dissipation, the main existing silicon-based pour structure, metal circuit board structure heat dissipation, solid crystalline material, epoxy resin, etc., system-level heat dissipation is mainly studied by related techniques, thereby innovating and improving the heat sink. With the popularity of high-power LEDs, the power of industrial and mining lamp manufacturers has grown. At present, system-level heat dissipation is mainly hot cooling. Heat tube heat dissipation and air-cooling forced heat dissipation is an effective way to improve LED industrial luminaire life. Therefore, further research and innovation are needed.